电器件后盖注塑模具设计

江西科技学院本科生毕业设计（论文）AbstractAccording to the general requirements for injection mold design of electroniccomponent covering.Firstly,the plastic molding process and the machining precision isanalyzed;Secondly,the injection molding machine has been selected and checked,results show that Haitian 80CX can fully meet the demand;Then the reasonablestructure design and material selection of the injection mold are discussed.Finally,theassembly and detail drawings have been completed using 3D modeling software,andwith a detail report and much of calculations,the graduation thesis is done.Key Word:Molding process:UG 3D modeling:Mould design;Injection moldingmachine;Mold material